ARBOR COM-830E - производительный процессорный модуль COM Express на базе Core 2 Duo / Celeron M , -40°C ~ +85 °C

Производитель: 
ARBOR Technology Corp. (Китай)

ARBOR COM-830E - производительный процессорный модуль COM Express на базе Core 2 Duo / Celeron M , -40°C ~ +85 °C

Features
COM Express Type II Core Module
Intel Core™ Duo/Core™ 2 Duo/Celeron M Processor FSB533/667MHz
DDRII 400/533/667MHz SO-DIMM up to 2GB
Dual Channels 24-bit LVDS
Realtek 8111B PCIe 10/100/1000 Base-T Ethernet
2 x SATAII, 8 x USB 2.0 and 2 x Serial Ports
3 PCIe x1 Lane and 1 x PCIe x16 Lanes, 4 x PCI Master
Wide Range Operating Temp.: -40 ~ 85°C

System
CPU Support Intel Core™ Duo/Core™2 Duo processor with
667MHz FSB
Support Intel Celeron M processor with 533MHz FSB
Memory 1 x 200-pin DDRII SO-DIMM 400/533/667MHz up to 2GB
Chipset Intel 945GME + ICH7M
BIOS Phoenix-Award PnP Flash BIOS

ATA/IDE
2 x Serial ATA ports with 150MB/s HDD transfer rate
1 x Ultra ATA 100/66/33 port, support 2 IDE devices

Watchdog Timer 255-level reset

I/O
Serial Port 2 x RS-232 ports (via PBE-1700)
Parallel Port SPP/EPP/ECP mode (via PBE-1700)
Floppy 1 x Floppy disk drive (via PBE-1700)
USB Port 8 x USB 2.0 ports
KB/MS PS/2 Keyboard and Mouse (via PBE-1700)

Expansion Bus
3 x PCIe x1 lane
1 x PCIe x16 lanes
4 x PCI master

Ethernet
Chipset 1 x Realtek 8111B PCIe 10/100/1000 base-T Ethernet

Display
Graphics Chipset Integrated with Intel® Graphics Media Accelerator (GMA950)
Graphics Interface CRT support up to 2048 x 1536
LCD support dual channels 24-bit LVDS

Mechanical & Environmental
Power Consumption 0.53A/5V, 2.66A/12V (Max.) (T2400 1.83GHz)
Operating Temp. -40 ~ 85°C (-40 ~ 185°F)
Operating Humidity 0 ~ 90% (non-condensing)
Dimensions (L x W) 125 x 95 mm (4.9" x 3.7")

Ordering Information
COM-830E
Intel Socket 478 Core™ Duo/Core™ 2 Duo/Celeron M CPU
PBE-1700
COM Express evaluation board in ATX form factor
HS-9455-W1
Heatsink w/fan (125 x 96 x 33 mm) for socket type CPU module